MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Pb37 Welding Flux for Mobile Phone Motherboard Repair.
- Specification:Material: Plastic + Solder
- PasteColor: as a picture display
- Micron: 25-45um
- Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
- bga paste 183c
JC V1S Battery Repair Board Flex Cable for iPhone 12 pro max
JCID V1S Speaker Flex for iPhone X
JC P7S Nand Programmer JCID BGA70 For iPhone 5SE-7P for iPad Pro
MECHANIC Q60 Powerful Antioxidant Flux Removes Oxide Layer Solder Paste Suitable for Mobile Phone Repair 




