MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Pb37 Welding Flux for Mobile Phone Motherboard Repair.

• Specification:Material: Plastic + Solder
• PasteColor: as a picture display
• Micron: 25-45um
• Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
• bga paste 183c