MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Pb37 Welding Flux for Mobile Phone Motherboard Repair.
- Specification:Material: Plastic + Solder
- PasteColor: as a picture display
- Micron: 25-45um
- Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
- bga paste 183c
Blue Silicon Full Size Mat Heat resistance For Mobile Repairing
Mechanic 0.2MM Superfine Soldering Tip Flyinf Line Iron Head 900M-T-TI 




