MECHANIC Solder Paste XG-50 Soldering Paste 183 degree XG 50 Sn63 Pb37 Welding Flux for Mobile Phone Motherboard Repair.
- Specification:Material: Plastic + Solder
- PasteColor: as a picture display
- Micron: 25-45um
- Applications: Mobile phone repair, computer and digital service industries, high-precision SMT circuit board welding, BGA welding process, etc.
- bga paste 183c
Mijing M22 Pro Multifunctional Magnetic Pad For BGA Reballing Motherboard CPU Chip Repair
SUNSHINE P-30A SHORT-KILLER PCB CIRCUIT DETECTION REPAIR TOOL
Relife RL-004FB Dot Matrix Multifunctional Repair Pad with Fixed Slot for iPhone X to 14Pro Max
Relife RL-004R Curved Magnetic Soldering Pad Suitable for CPU Chips Repair
High heat resistance Silicone repair for Mobile Phone BGA Soldering Iron Repair Mat
2UUL Pre-Cut Thermal Silicone Pads 12x12x1.5mm
MECHANIC AAS-14 High Precision Extended Thickening TWEEZER 




