MIJING A18 and A18 pro Stencil for Z21 MAX CPU Reballing
MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone16 Pro Max
Features:
1. High-temperature resistance and abrasion resistance.
2. Imported alloy steel, metal fatigue resistance, make the product more durable.
3. Dirt-resistant, easy to clean.
4. High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil
HW:2 BGA Stencil for Huawei G7/G8/7I/5S MSM8916/8939/MT6753V CPU 



