MIJING A18 and A18 pro Stencil for Z21 MAX CPU Reballing
MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone16 Pro Max
Features:
1. High-temperature resistance and abrasion resistance.
2. Imported alloy steel, metal fatigue resistance, make the product more durable.
3. Dirt-resistant, easy to clean.
4. High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
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HW:2 BGA Stencil for Huawei G7/G8/7I/5S MSM8916/8939/MT6753V CPU 




