MIJING A18 and A18 pro Stencil for Z21 MAX CPU Reballing
MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone16 Pro Max
Features:
1. High-temperature resistance and abrasion resistance.
2. Imported alloy steel, metal fatigue resistance, make the product more durable.
3. Dirt-resistant, easy to clean.
4. High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
AMAOE IPHONE8/8P/X STAINLESS STEEL BGA REBALLING STENCIL
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil 




