Mijing KC8 Quicky Remove Maintenance Knife Set for Mobile Phone Motherboard Glue Removal.

Features:

• Press the rebound structure, quickly remove the blade

• Multi-functional mijing kc8  glue removal knife, high-temperature resistance, corrosion resistance, high hardness, high toughness, fine high carbon elastic steel, pure hand polished

• A variety of options to provide you with solutions to all kinds of maintenance problems, cutting black glue, side glue removal, motherboard glue removal, prying hard disk, etc.

• Pure hand polishing, surface vacuum plating process, with strong corrosion resistance and high-temperature durability, and wear resistance

• Mijing kc8 blade design, rigid and flexible, with strength, more toughness

• Fine high-carbon elastic steel blade grinding, toughness, rebound does not deform

• Comfortable grip, with a universal ergonomic knife handle

• Each piece of blade material is laser cut to ensure a high degree of product uniformity