Mijing Z20 Pro 4-in-1 Motherboard Middle Layer Planting Tin Platform for iPhone 15 Series
UPGRADE Z20 PRO WITH IPHONE 15 SERIES
Features:
- Mijing 4-in-1 BGA Reballing Stencil Platform for iPhone 15/ 15 Plus / 15 Pro/ 15Pro Max is convenient and faster for reballing BGA without any damage, offers you the best solution for iPhone 15 series BGA reballing and repairing
How to use:
- Install the main board on the platform
- Cover the BGA reballing stencil on the mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point
Adjustable 130X 55mm High Working Area Video Microscope Lens
SOPTOP SZN71 Trinocular Co-visual Microscope 6.7-45 Continuous Zoom for Mobile Phone Repair
Volder 8586D 2in1 Hotair and Soldering Iron SMD Station
RELIFE RL-601T 22 in 1 Middle Layer Motherboard Reballing Soldering Platform With Stencil for iPhone X-15 Series
JCID Iphone 11 Pro Flex Cable for Face ID Programmer
Amaoe MU4 BGA Stencil for samsung a32 MT6853 MT6885 MT6891 MT6769 MT6779 MT6768 CPU IC Bottom Layer
Mijing KC8 Quicky Remove Maintenance Knife Set for Mobile Phone Motherboard Glue Removal.
Mijing M22 Pro Multifunctional Magnetic Pad For BGA Reballing Motherboard CPU Chip Repair 




