Mijing Z21 Max BGA Stencil Platform Set for Android

Mijing Z21 Max BGA Stencil Platform Set for Android / Hisilicon / Qualcomm Snapdragon

Features:

• Automatic precise positioning
• The new magnetic dynamic original positioning
• Strong magnetic force automatic clamping

Installation Method:

• Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
• Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)