Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for Android

Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for Android

Features:

• Automatic precise positioning

• The new Mijing Z21 Max magnetic dynamic original positioning

• Strong magnetic force automatic clamping
• CPU SM8250-102
• Hi3690 5G cpu
• Hi 36A0 cpu
• EMMC BGA 153 cpu
• Hi6290/L cpu
• HI3690 cpu
• Hi3680 cpu
• SM8250-202 cpu
• Sm8350/888 cpu
• Hi3670 cpu
• 855/SM8150 cpu
• 845/SDM845 cpu
• Hi3670  cpu

Installation Method:

• Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)

• Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)