Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for Android
Features:
- Automatic precise positioning
- The new Mijing Z21 Max magnetic dynamic original positioning
- Strong magnetic force automatic clamping
- CPU SM8250-102
- Hi3690 5G cpu
- Hi 36A0 cpu
- EMMC BGA 153 cpu
- Hi6290/L cpu
- HI3690 cpu
- Hi3680 cpu
- SM8250-202 cpu
- Sm8350/888 cpu
- Hi3670 cpu
- 855/SM8150 cpu
- 845/SDM845 cpu
- Hi3670 cpu
Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)