RELIFE RL-601T 31 in 1 iPhone X-17 PM 16E Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil

Features:

• Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15Pro Max/ 16 pro max / 17 pro max

• Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit

• Precise positioning / Fast tin planting / Strong magnetic adsorption

• Universal base, unlimited compatibility, continuous model update, unlimited stacking without changing the base, One-time purchase, long-lasting use

• Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism

• Comes with precise positioning, so it is more convenient to align the holes

• High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls

• Anti-drum, so that each solder ball is round and full, to meet the needs of various chips

• High quality environmentally friendly stone, high strength, anti-dirt, easy to clean

• Wear-resistant and anti-skid, shock absorption and compression resistance, anti-aging

• The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing