Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+
Exynos9810 For Snapdragon
845 CPU Baseband eMMC Wifi Touch Power PA IC
FOR SAMSUNG S9/S9PLUS
Model Number: Amaoe SAM7
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
2UUL UNIVERSAL PHONE BOARD MID FRAME REBALLING MAGNETIC PLATFORM
2UUL Solder Wire Exclusive Usage for Battery Metal Board Welding No Need Spot Welding Machine Soldering Line Repairing
2uul TW31 Ultrahard Insulative Ceramic Tweezer for Motherboard Precision Repair
JTX JS-12 10mm Nozzle Universal Elbow Hot Air Gun Nozzle with Blade
Stencil for Huawei P8 P9 Honor 4X/4C/5A/5C HI6220 MAM8952 HW:4 




