Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+
Exynos9810 For Snapdragon
845 CPU Baseband eMMC Wifi Touch Power PA IC
FOR SAMSUNG S9/S9PLUS
Model Number: Amaoe SAM7
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
2UUL Hand Finish Blades For Phone Screen Debonding / Removal IC, Model:Y
WLXY Precision Knife With 6 Blades
SM5703A IC for A8 A8000 J700H J500F charging USB charging charger IC
Mechanic FR1 High Toughness Carbon Steel Sharp Blade Set for Remove LCD Screen
AMAOE MI4 Stencil XIAOMI Redmi Note 2/3/Xiaomi X MSM8956/MT6795 CPU/RAM EMMC WIFI AUDIO POWER Chip 




