Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+
Exynos9810 For Snapdragon
845 CPU Baseband eMMC Wifi Touch Power PA IC
FOR SAMSUNG S9/S9PLUS
Model Number: Amaoe SAM7
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
Amaoe QU1 BGA Reballing Stencil For Qualcomm CPU MSM8996 MSM8976 MSM899 




