Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+
Exynos9810 For Snapdragon
845 CPU Baseband eMMC Wifi Touch Power PA IC
FOR SAMSUNG S9/S9PLUS
Model Number: Amaoe SAM7
Material: STAINLESS STEEL
Usage: Commercial Manufacture
thickness: 0.12mm
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM 




