Type: UNIVERSAL USE FOR DIFFERENT SIZE BGA ICS BLACK COLOUR FOR LOOK IN MICROSCOPE EASY STENCIL BYMEGA IDEA
Origin: CN(Origin)
Model Number: MEGA-IDEA BGA Reballing Stencil
is_customized: No
Material: STAINLESS STEEL
Usage: Commercial Manufacture
Shipment cost not included.
For less than 5kg 500 cost will charge.
For more than 5kg 1000 cost will charge.
| Weight | 0.1 kg |
|---|
2uul BH17 CPU REBALL BASE Magnetic Dual-Sided BGA Reballing Platform Set for iPhone / Android
AMAOE Stencil Power IC PM2 Maxin MAX:1 MTK MT:1 MT:2 Series 0.12 mm Power BGA Reballing Stencil
Iphone 6 6p ic chip BGA Stencil
Amaoe BGA Reballing Stencil CAR 2 For Car Host Chip DRA655ATSCICYEQ1 Steel Mesh
Amaoe Stencil for MT1/MAX1/MT1/PM1 MTK MT Power Maxim Max Power Qualcomm
MECHANIC Solder Paste XG-50 Soldering BGA Paste 183 degree 



