YCS 2S CPU Heating Platform Magical Degumming Station For Mobile Phone IC CPU Heating Glue Removal Solder Removal BGA Reball

• 2s-Zone Heating: Ensures consistent temperature across the platform for safe chip handling.

• Precision Temperature Control: Adjustable settings allow optimal heat for delicate ICs and CPUs.

• Fast Heating Core: Quickly reaches working temperatures to save time and boost efficiency.

• Stable Platform Design: Holds components securely during degumming and rework operations.

• Versatile Use: Ideal for glue removal, solder residue cleaning, chip separation, and BGA reballing.